Back-end test and packaging
하이브리드 본딩
hybrid bonding
DraftVersion 0.1.1Updated 2026-10-09
- Definition(Written in Korean)
- 범프 없이 구리 패드와 절연막을 맞붙여 다이나 웨이퍼를 잇는 접합 방식입니다. 접점 간격을 더 좁힐 수 있습니다.
- Synonyms
- 직접 본딩 · Cu-Cu 본딩
- English
- hybrid bonding
- Broader term
- 패키징packaging
- Related terms
- 범프bumpHBMhigh bandwidth memory
- Added in version
- 0.1.0
- Permanent URI
https://ontocraft.com/terms/hybrid-bonding
JSON-LD for this term- Citation
- OntoCraft Korean Industrial Term Registry, “하이브리드 본딩” (hybrid bonding), version 0.1.1, https://ontocraft.com/terms/hybrid-bonding, CC BY 4.0.
CC BY 4.0. Source: OntoCraft Korean Industrial Term Registry · License text