Back-end test and packaging
패키징
packaging
DraftVersion 0.1.1Updated 2026-10-09
- Definition(Written in Korean)
- 다이를 외부 회로와 전기적으로 잇고 충격과 습기에서 보호하도록 감싸는 공정입니다.
- Synonyms
- 패키지 · 어셈블리
- English
- packaging
- Broader term
- 후공정back-end process
- Narrower terms
- 플립칩flip chip하이브리드 본딩hybrid bonding
- Related terms
- 플립칩flip chip범프bump
- Added in version
- 0.1.0
- Permanent URI
https://ontocraft.com/terms/chip-packaging
JSON-LD for this term- Citation
- OntoCraft Korean Industrial Term Registry, “패키징” (packaging), version 0.1.1, https://ontocraft.com/terms/chip-packaging, CC BY 4.0.
CC BY 4.0. Source: OntoCraft Korean Industrial Term Registry · License text