Back-end test and packaging
TSV
through-silicon via
DraftVersion 0.1.1Updated 2026-10-09
- Definition(Written in Korean)
- 다이를 위아래로 뚫어 금속으로 채운 수직 전극입니다. 쌓은 다이끼리 짧은 경로로 신호를 주고받게 합니다.
- Synonyms
- 실리콘 관통 전극
- English
- through-silicon via
- Related terms
- HBMhigh bandwidth memory범프bump
- Added in version
- 0.1.0
- Permanent URI
https://ontocraft.com/terms/through-silicon-via
JSON-LD for this term- Citation
- OntoCraft Korean Industrial Term Registry, “TSV” (through-silicon via), version 0.1.1, https://ontocraft.com/terms/through-silicon-via, CC BY 4.0.
CC BY 4.0. Source: OntoCraft Korean Industrial Term Registry · License text