Back-end test and packaging

백그라인딩

back grinding

Definition(Written in Korean)

회로가 없는 웨이퍼 뒷면을 갈아 두께를 줄이는 후공정 단계입니다. 다이싱과 패키징 전에 하며, 다이를 여러 층 쌓는 HBM처럼 얇은 칩이 필요할수록 휨과 깨짐 관리가 중요해집니다.

Synonyms

웨이퍼 박화 · BG

English

back grinding

Broader term

후공정back-end process

Related terms

다이싱wafer dicingHBMhigh bandwidth memoryTSVthrough-silicon via

Added in version

0.2.0

Permanent URI

https://w3id.org/ontocraft/terms/back-grinding

JSON-LD for this term

Citation

OntoCraft Korean Industrial Term Registry, “백그라인딩” (back grinding), version 0.2.0, https://w3id.org/ontocraft/terms/back-grinding, CC BY 4.0.