Front-end wafer processing
CMP
chemical mechanical polishing
DraftVersion 0.1.1Updated 2026-10-09
- Definition(Written in Korean)
- 연마 패드와 슬러리로 웨이퍼 표면을 깎아 평평하게 만드는 공정입니다. 다음 층의 노광 초점을 맞추려면 필요합니다.
- Synonyms
- 화학적 기계 연마 · 평탄화
- English
- chemical mechanical polishing
- Broader term
- 전공정front-end process
- Related terms
- 막 두께film thickness공정 케미컬process chemical
- Added in version
- 0.1.0
- Permanent URI
https://ontocraft.com/terms/chemical-mechanical-polishing
JSON-LD for this term- Citation
- OntoCraft Korean Industrial Term Registry, “CMP” (chemical mechanical polishing), version 0.1.1, https://ontocraft.com/terms/chemical-mechanical-polishing, CC BY 4.0.
CC BY 4.0. Source: OntoCraft Korean Industrial Term Registry · License text